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PD - 90885D
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-1)
Product Summary
Part Number Radiation Level IRHN9150 100K Rads (Si) IRHN93150 300K Rads (Si) RDS(on) 0.080 0.080 ID -22A -22A
IRHN9150 JANSR2N7422U 100V, P-CHANNEL
REF: MIL-PRF-19500/662 RAD Hard HEXFET TECHNOLOGY
QPL Part Number JANSR2N7422U JANSF2N7422U
TM (R)
SMD-1
International Rectifier's RADHard HEXFETTM technology provides high performance power MOSFETs for space applications. This technology has over a decade of proven performance and reliability in satellite applications. These devices have been characterized for both Total Dose and Single Event Effects (SEE). The combination of low Rdson and low gate charge reduces the power losses in switching applications such as DC to DC converters and motor control. These devices retain all of the well established advantages of MOSFETs such as voltage control, fast switching, ease of paralleling and temperature stability of electrical parameters.
Features:
n n n n n n n n n n
Single Event Effect (SEE) Hardened Low RDS(on) Low Total Gate Charge Proton Tolerant Simple Drive Requirements Ease of Paralleling Hermetically Sealed Surface Mount Ceramic Package Light Weight
Absolute Maximum Ratings
Parameter
ID @ VGS = -12V, TC = 25C ID @ VGS = -12V, TC = 100C IDM PD @ TC = 25C VGS EAS I AR EAR dv/dt TJ TSTG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range PCKG Mounting Surface Temp. Weight For footnotes refer to the last page -22 -14 -88 150 1.2 20 500 -22 15 -23 -55 to 150 300 ( for 5s) 2.6 (typical)
Pre-Irradiation
Units A
W
W/C
V mJ A mJ V/ns
o
C
g
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1
01/29/01
IRHN9150, JANSR2N7422U
Pre-Irradiation
Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified)
Parameter
BVDSS BVDSS/TJ RDS(on) VGS(th) gfs IDSS Drain-to-Source Breakdown Voltage Temperature Coefficient of Breakdown Voltage Static Drain-to-Source On-State Resistance Gate Threshold Voltage Forward Transconductance Zero Gate Voltage Drain Current
Min
-100 -- -- -- -2.0 11 -- -- -- -- -- -- -- -- -- -- -- --
Typ Max Units
-- -0.093 -- -- V V/C V S( ) A
Test Conditions
VGS = 0V, ID =-1.0mA Reference to 25C, ID = -1.0mA VGS = -12V, ID = -14A VGS = -12V, ID = -22A VDS = VGS, ID = -1.0mA VDS >-15V, IDS = -14A VDS= -80V ,VGS=0V VDS = -80V, VGS = 0V, TJ = 125C VGS = -20V VGS = 20V VGS =-12V, ID = -22A VDS = -50V VDD = -50V, ID = -22A, VGS =-12V, RG = 2.35
-- 0.080 -- 0.085 -- -4.0 -- -- -- -25 -- -250 -- -- -- -- -- -- -- -- -- 4.0 -100 100 200 35 48 40 170 190 190 --
IGSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LS + LD
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance
nA nC
ns
nH
Measured from the center of drain pad to center of source pad VGS = 0V, VDS = -25V f = 1.0MHz
Ciss Coss Crss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
-- -- --
4300 1100 310
-- -- --
pF
Source-Drain Diode Ratings and Characteristics
Parameter
IS ISM VSD t rr QRR t on Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Min Typ Max Units
-- -- -- -- -- -- -- -- -- -- -22 -88 -3.0 300 1.5
Test Conditions
A
V nS C
Tj = 25C, IS = -22A, VGS = 0V Tj = 25C, IF = -22A, di/dt -100A/s VDD -50V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC RthJ-PCB Junction-to-Case Junction-to-PC board
Min Typ Max Units
-- -- -- 6.6 0.83 --
C/W
Test Conditions
soldered to a 1"sq. copper-clad board
Note: Corresponding Spice and Saber models are available on the G&S Website. For footnotes refer to the last page
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Radiation Characteristics Pre-Irradiation
IRHN9150, JANSR2N7422U
International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance program at International Rectifier is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-3 package. Both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison.
Table 1. Electrical Characteristics @ Tj = 25C, Post Total Dose Irradiation
Parameter
BVDSS VGS(th) IGSS IGSS IDSS RDS(on) RDS(on) VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-3) Static Drain-to-Source On-State Resistance (SMD-1) Diode Forward Voltage
100K Rads(Si)1 300K Rads (Si)2
Units V nA A V
Test Conditions
VGS = 0V, ID = -1.0mA VGS = VDS, ID = -1.0mA VGS = -20V VGS = 20 V VDS=-80V, VGS =0V VGS = -12V, ID =-14A VGS = -12V, ID =-14A VGS = 0V, IS = -22A
Min -100 -2.0 -- -- -- -- -- --
Max -- -4.0 -100 100 -25 0.081 0.080 -3.0
Min -100 -2.0 -- -- -- -- -- --
Max -- -5.0 -100 100 -25 0.081 0.080 - 3.0
1. Part number IRHN9150 (JANSR2N7422U) 2. Part numbers IRHN93150 (JANSF2N7422U)
International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.
Table 2. Single Event Effect Safe Operating Area
Ion Br I Cu LET MeV/(mg/cm2)) 36.8 59.8 28 Energy (MeV) 305 343 285 Range (m) @VGS=0V @VGS=5V 39 -100 -100 32.6 -60 -- 43 -100 -100 VDS (V) @VGS=10V -70 -- -100 @VGS=15V -50 -- -70 @VGS=20V -40 -- -60
-120 -100 -80 VDS -60 -40 -20 0 0 5 10 VGS 15 20 Cu Br I
Fig a. Single Event Effect, Safe Operating Area
For footnotes refer to the last page
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3
IRHN9150, JANSR2N7422U
Pre-Irradiation
100
-I D , Drain-to-Source Current (A)
-5.0V
20s PULSE WIDTH T = 25 C
J 1 10 100
-I D , Drain-to-Source Current (A)
VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP
100
VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP
-5.0V
20s PULSE WIDTH T = 150 C
J 1 10 100
10
10
-VDS , Drain-to-Source Voltage (V)
-VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
3.0
R DS(on) , Drain-to-Source On Resistance (Normalized)
ID = -22A
Drain-to-Source Current (A)
TJ = 25 C
2.5
2.0
TJ = 150 C
1.5
1.0
- ID,
0.5
10 5 6 7
V DS = -50V 20s PULSE WIDTH 8 9 10
- VGS , Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
0.0 -60 -40 -20
VGS = -12V
0 20 40 60 80 100 120 140 160
TJ , Junction Temperature ( C)
Fig 4. Normalized On-Resistance Vs.Temperature
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Pre-Irradiation
IRHN9150, JANSR2N7422U
7000
6000
-VGS , Gate-to-Source Voltage (V)
VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd
20
ID = -22A
16
C, Capacitance (pF)
5000
Ciss
V DS = -80V V DS = -50V V DS = -20V
4000
12
3000
8
2000
C oss C rss
1 10 100
4
1000
0
0 0 40 80
FOR TEST CIRCUIT SEE FIGURE 13
120 160 200
-VDS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
100
1000
-ISD , Reverse Drain Current (A)
OPERATION IN THIS AREA LIMITED BY R
DS(on)
-ID , Drain Current (A) I
100
TJ = 150 C
10
100us 1ms
10
TJ = 25 C
10ms
1 0.0
V GS = 0 V
1.0 2.0 3.0 4.0
1
TC = 25 C TJ = 150 C Single Pulse
1 10 100 1000
-VSD ,Source-to-Drain Voltage (V)
-VDS , Drain-to-Source Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
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IRHN9150, JANSR2N7422U
Pre-Irradiation
24
V DS VGS RG
RD
20
D.U.T.
+
-ID , Drain Current (A)
16
12
VGS Pulse Width 1 s Duty Factor 0.1 %
8
Fig 10a. Switching Time Test Circuit
td(on) tr t d(off) tf
4
VGS 10%
0 25 50 75 100 125 150
TC , Case Temperature ( C)
90% VDS
Fig 9. Maximum Drain Current Vs. CaseTemperature
Fig 10b. Switching Time Waveforms
1 D = 0.50
Thermal Response (Z thJC )
0.20 0.1 0.10 0.05 0.02 0.01
0.01
SINGLE PULSE (THERMAL RESPONSE)
0.001 0.00001
Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.1 0.0001 0.001 0.01 1
P DM t1 t2
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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-
V DD
Pre-Irradiation
IRHN9150, JANSR2N7422U
VDS
L
EAS , Single Pulse Avalanche Energy (mJ)
1200
RG
D .U .T
IA S
VD D A D R IV E R
1000
-20V VGS
ID -9.8A -14A BOTTOM -22A TOP
tp
0.0 1
800
600
15V
400
Fig 12a. Unclamped Inductive Test Circuit
200
IAS
0 25 50 75 100 125 150
Starting TJ , Junction Temperature ( C)
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
tp V (BR)DSS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator Same Type as D.U.T.
50K
QG
-12V 12V
.2F .3F
-12V
QGS VG QGD
VGS
-3mA
Charge
IG
ID
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
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+
D.U.T.
-
VDS
7
IRHN9150, JANSR2N7422U
Pre-Irradiation
Foot Notes:
Repetitive Rating; Pulse width limited by
maximum junction temperature. VDD = -25V, starting TJ = 25C, L= 2.1mH Peak IL = -22A, VGS = -12V ISD -22A, di/dt -450A/s, VDD -100V, TJ 150C
Pulse width 300 s; Duty Cycle 2% Total Dose Irradiation with VGS Bias.
12 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, method 1019, condition A. Total Dose Irradiation with VDS Bias. 80 volt VDS applied and VGS = 0 during irradiation per MlL-STD-750, method 1019, condition A.
Case Outline and Dimensions -- SMD-1
PAD ASSIGNMENTS
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 01/01
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